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- "Standard Packages and Lids for Device evalsuation" list is updated.
Ceramic Packages
News
April 03, 2023
"Standard Packages and Lids for Device evalsuation" list is updated.
April 03, 2023
"Standard Packages and Lids for Device evalsuation" list is updated.
"Standard Packages and Lids for Device evalsuation" list is updated.
- "C-DIP (Ceramic Dual Inline Packages)" (112KB) Updated
- "C-SOP (Ceramic Small Outline Packages)" (32KB) Updated
- "C-PGA (Ceramic Pin Grid Array Packages)" (96KB) Updated
- "Ceramic Hybrid Packages" (120KB) Updated
Archive
Product Categories
- Components for LiDAR and 3D Sensing
- Compact Ceramic RFID Tags
- Components for Fiber-Optic Communication Modules
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Ceramic Packages for MEMS Sensors
- Ceramic Packages and Optical Filters for Image Sensors
- Components for Fiber-Optic Connectors
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Surface Mount Ceramic Packages for Electronic Devices
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Ceramic Packages for Light Emitting Diodes (LEDs)
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LTCC Packages for RF Modules
- Ceramic Packages for Automotive Electronics
- Ceramic Packages for Power Electronics
- Components for Wireless Communication Devices
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Ceramic Packages for Large Scale Integration (LSI) Devices
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Ceramic Substrates for Probe Cards
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Glass Hermetic Feedthroughs
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Standard Packages and Lids for Device evalsuation